Tin Solder Ball BGA Lead-Free Reballing Soldering Heat Universal Stencil Balls for GPU CPU IC Chip PCB(9 Bottles 0.3mm-0.76mm)

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Tin Solder Ball BGA Lead-Free Reballing Soldering Heat Universal Stencil Balls for GPU CPU IC Chip PCB(9 Bottles 0.3mm-0.76mm)

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SKU:

FF200723

UPC:

792117157882

Condition:

New

Availability:

Free Shipping from the USA. Estimated 2-4 days delivery.