Walfront BGA Lead?Free Solder Balls PCB boards 0.4mm Tin Sphere 25W Soldering Reballing Accessories

Walfront BGA Lead?Free Solder Balls PCB boards 0.4mm Tin Sphere 25W Soldering Reballing Accessories

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SKU:
ZC211458
Condition:
New
Availability:
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Specification: Conditon: 100% Brand New Item Type: Lead?Free Solder Ball Material: Sn96.5% / Ag3% / Cu0.5% Specification: Approx.0.4mm / 0.016in 250,000 grains Application: Suitable for Chip BGA reballing, BGA package soldering, filling, maintenance Package List: 1 x Bottle of Tin Balls
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