VIPFIX High Precision 3D BGA Reballing Stencil Template Professional Planting Tin Net BGA IC Chipset for iPhone A8/A9/A10/A11 CPU Repair(A11 for 8 8P X)

VIPFIX High Precision 3D Groove Tin Steel BGA Reballinng Stencil Template BGA IC Chipset For iPhone A8/A9/A10/A11 CPU Repair Tools Product Introduction: ?New patented BGA rework stencils: MJ 3D BGA Reballing Stencil template, iPhone A8 A9 A10 groove Reballing Stencil Template, iphone 6/6 plus, iphone 6s/6s plus and iphone 7 /7plus 3D BGA Reballing Stencil template. ?New patented groove BGA rework stencils: MJ 3D BGA Reballing Stencil template ?New Style 3D BGA planting Stencil: Stepped groove / easy to use / Accuratea Lignment Product Features: ?1.Stepped groove design enables stencil to align with tinning position of IC rapidly. ?2.The square holes design makes it easier to take out the formed solder balls. ?3.This 3D stencil is easy to use no matter you are a new or expert. ?4.High success rate of planting tin,the solder balls can be formed once after you are proficient. ?5.This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer. Product Optionals: ?Optional 1: MJ 3D A8 MJ 3D A8: iphone 6/6 plus IC: Touch IC, Baseband, font IC, audio IC, power IC, A8 CPU ?Optional 2: MJ 3D A9 MJ 3D A9: iphone 6s/6s plus: Touch IC, Baseband, font IC, audio IC, power IC, A9 CPU ?Optional 3: MJ 3D A10 MJ 3D A10: iphone 7 /7plus: Touch IC, Baseband, font IC, audio IC, power IC, A10 CPU ?Optional 3: MJ 3D A11 MJ 3D A11: iPhone 8 8P X, Touch IC, Baseband, font IC, audio IC, power IC, A11 CPU