PhoneFix High Precision 0.12MM Multi-Purpose BGA Reballinng Stencil Template BGA IC Chipset for iPhone 6 6P 6S 6SP 7 7P 8 8P CPU Repair
VIPFIX 0.12mm Multi-Purpose Phone BGA Reballing Stencil Template Kits Set for iPhone 6 6P 6S 6SP 7 7P 8 8P PCB NAND CPU Soldering Repair (6S 6SP)
$7.44
- SKU:
- III406211
- UPC:
- 733810676843
- Condition:
- New
- Availability:
- Free Shipping from the USA. Estimated 2-4 days delivery.