VIPFIX 0.12mm Multi-Purpose Phone BGA Reballing Stencil Template Kits Set for iPhone 6 6P 6S 6SP 7 7P 8 8P PCB NAND CPU Soldering Repair (6S 6SP)

$7.44
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SKU:
III406211
UPC:
733810676843
Condition:
New
Availability:
Free Shipping from the USA. Estimated 2-4 days delivery.
PhoneFix High Precision 0.12MM Multi-Purpose BGA Reballinng Stencil Template BGA IC Chipset for iPhone 6 6P 6S 6SP 7 7P 8 8P CPU Repair