Universal BGA Reballing Stencils Template Solder Steel Mesh Directly Heat Set Kit BGA Rework Net Phone Repair Tools for S20

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SKU:
ZDS866230
Condition:
New
Availability:
Free Shipping from the USA. Estimated 2-4 days delivery.
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Specification:
Item Type: BGA Reballing Stencil Template
Material: Stainless steel
Pitch: 0.12mm
Compatible CPU: For Snapdragon 865, for SM8250, for Exynos 990 CPU
Suitable Product Model: For S20 series, for G988U, for G988B,BR, etc.

How to Use:
Direct use

Package List:
1 x BGA Reballing Stencil Template