Specification:
Item Type: BGA Reballing Stencil Template
Material: Stainless steel
Pitch: 0.12mm
Compatible CPU: For Snapdragon 865, for SM8250, for Exynos 990 CPU
Suitable Product Model: For S20 series, for G988U, for G988B,BR, etc.
How to Use:
Direct use
Package List:
1 x BGA Reballing Stencil Template
Item Type: BGA Reballing Stencil Template
Material: Stainless steel
Pitch: 0.12mm
Compatible CPU: For Snapdragon 865, for SM8250, for Exynos 990 CPU
Suitable Product Model: For S20 series, for G988U, for G988B,BR, etc.
How to Use:
Direct use
Package List:
1 x BGA Reballing Stencil Template