Universal BGA Reballing Stencil Stainless Steel Tin Mesh Solder Template BGA Reballing Stencil for Phone

Universal BGA Reballing Stencil Stainless Steel Tin Mesh Solder Template BGA Reballing Stencil for Phone

Was: $61.96

Now: $30.98

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SKU:: ZD236567
UPC:
Condition:: New
Availability:: Free Shipping from the USA. Estimated 2-4 days delivery.

Current Stock:

Quantity:

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Description

Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable Product Model: For A520, A310, S5mini series, universal for A7, A5, A3, S5, J7 series.

How to Use:
Direct use.

Package List:
1 xPhone CPU BGA Reballing Stencil

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