BGA Reballing Stencils Universal Stainless Steel Reballing BGA Rework Net Stencils Templates, BGA Reballing Net, Tin Mesh Solder Template, Phone BGA IC Chips Repair Tools, Soldering Accessories

Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. 2. PRECISE POSITIONING: Tin planting template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature. 3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use. 4. BGA REBALLING STENCIL FOR PHONE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs. IC chips repair accessories. 5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life. How to Use: Use directly Specification: Item Type: BGA Reballing Stencil Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in Product Material: Stainless Steel Package List: 1 x BGA Reballing Stencil