Bga Reballing Stencil Universal Directly Heat Templates Rework Net Stainless Steel Mesh CPU Repair Tool 33pcs

Description These BGA reballing stencils were made by stainless steel material, can be heated by the hot air machine to improve peormance and reliability, not easy to deform when heated. It is easy and quickly for reballing the BGA IC. The mold area of the worktable matches the area of the BGA chip, which can reduce the waste of solder balls. Features BGA reballing stencil -Color: Silver. -Material: Stainless steel. -Size: 8x8x8 cm/3.15x3.15x3.15 inch. The reball stencils template is suitable for BGA heavy ball general molds of desktop laptops, game consoles, etc. to be directly heated and reworked for general chip repair. Package Including 2 * BGA stencils for 0.35mm solder ball n1 * BGA stencils for 0.4mm solder ball n14 * BGA stencils for 0.5mm solder ball n13 * BGA stencils for 0.6mm solder ball